Multiphysics topology optimization for laminated busbars

Oriol Puigdellivol; Yvonnick Le Menach; Souad Harmand; Damien Meresse; Jean-Francois Wecxsteen

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https://doi.org/10.1...arrow_drop_down

https://doi.org/10.1109/cefc.2...

Article . 2016 . Peer-reviewed

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https://dx.doi.org/10.1109/cef...

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Multiphysics topology optimization for laminated busbars

descriptionPublicationkeyboard_double_arrow_right Article 01 Nov 2016Publisher:IEEEJournal:2016 IEEE Conference on Electromagnetic Field Computation (CEFC)

Authors: Oriol Puigdellivol; Yvonnick Le Menach; Souad Harmand; Damien Meresse; Jean-Francois Wecxsteen;

doi: 10.1109/cefc.2016.7816294

Multiphysics topology optimization for laminated busbars

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Abstract

Laminated busbars acquire significant importance even if they are a passive component in converters. Their flat and overlapped conducting layers allow good heat dissipation and reduced stray inductance. Topology optimization enables balancing the amount of copper used with the maximum temperature and stray inductance of the busbar.

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