Continuously increasing application demands on both High Performance Computing (HPC) and Embedded Systems (ES) are driving the IC manufacturing industry on an everlasting scaling of devices in silicon. Nevertheless, integration and miniaturization of transistors comes with an important and non-negligible trade-off: time-zero and time-dependent performance variability. Increasing guard-bands to battle variability is not scalable, since worst-case design margins are prohibitive for downscaled technology nodes. This paper discusses the FP7-612069-HARPA project of the European Commission which aims to enable next-generation embedded and high-performance heterogeneous many-cores to cost-effectively confront variations by providing Dependable-Performance: correct functionality and timing guarantees throughout the expected lifetime of a platform under thermal, power, and energy constraints. The HARPA novelty is in seeking synergies in techniques that have been considered virtually exclusively in the ES or HPC domains (worst-case guaranteed partly proactive techniques in embedded, and dynamic best-effort reactive techniques in high-performance).