The objective of the ACT10 project is to develop and demonstrate the required technology options, including their integration, for the 10Ångstrom node. The 32 participating partners cover a wide range of activities along the entire value chain for the manufacturing of CMOS chips. Activities include equipment development, computer aided design tooling and process technology development. Essential parts of hardware, software and processing technology are developed pushing the boundaries of semiconductor design and manufacture to enable the new node and keep Moore’s law alive. The project aims to enhance the attractiveness of the EU as a location for new cutting-edge high volume and legacy node fabs. The ACT10 project is built based on the following four pillars. 1. Lithography Equipment and Mask Technology: Increase key-performance indicators in the optical system of High-NA Lithography machines, along with developing advanced mask processes and equipment to reach optical imaging requirements, and nonlinear optics material lifetime effects. 2. Chip design and Block Level validation; Assessment of different CFET devices and evaluate building blocks for digital and analog IPs. 3. Process Technology: development of innovative solutions for routing of the stacked n- and p-devices of the CFET architecture, development of 0.55NA (high-NA) single patterning solutions, and the development of semi-damascene BEOL for the 10Å node. 4. Computational Metrology and Process Monitoring Equipment: develop computational metrology methods, and develop metrology and inspection modules and equipment.