Views provided by UsageCounts
This paper presents a novel test system, which is optimized to simulate temperature mission profiles of various applica- tions, which exhibit large temperature changes. The aim is to treat the investigated power semiconductor as a “black box” without the need for a lifetime model. A microcontroller controls the self-heating of the device under test to generate the necessary power losses. Simultaneously the microcontroller acquires measurement data of the device under test (DUT) based on a pre-defined test plan. To simulate also negative ambient temperatures the DUT is mounted on a cooling system. The test system has a high flexibility within a wide temperature range and can be used to simulate various application conditions, especially for applications with a large temperature swing. A mission profile focusing on the application of power semiconductors within solar inverters is used as a reference. Based on such a mission profile, heating current, gate voltage and chiller temperature are adjusted automatically to drive the system to all temperature conditions the DUT is expected to be exposed to during its lifetime in its target application.
Semiconductor Reliability, Mission Profiles, Reliability Testing
Semiconductor Reliability, Mission Profiles, Reliability Testing
| selected citations These citations are derived from selected sources. This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically). | 0 | |
| popularity This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network. | Average | |
| influence This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically). | Average | |
| impulse This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network. | Average |
| views | 2 |

Views provided by UsageCounts