A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems

descriptionPublicationkeyboard_double_arrow_right Article , Conference object 01 Jun 2020Publisher:IEEEJournal:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)Funded by:EC | SERENA

Authors: Ndip, Ivan; Andersson, Kristoffer; Kosmider, Stefan; Le, Thi Huyen; Kanitkar, Abhijeet; van Dijk, Marius; Senthil Murugesan, Kavin; +8 Authors

doi: 10.1109/ectc32862.2020.00029 , 10.5281/zenodo.4020211 , 10.5281/zenodo.4020212

A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems

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Abstract

In this work, we present a novel packaging and system-integration platform with integrated antennas (antenna-in-package, AiP, platform) for 5G millimeter-wave (mmWave) systems. We illustrate the application of the platform for the development of miniaturized, scalable, low-cost and high-performance 5G mmWave systems for new radio (NR) base stations. RF characterization of the dielectric material of the platform and the integrated mmWave antennas as well as thermal investigations of the platform are presented. The process steps required for the fabrication of the platform are discussed, and an example of a mmWave chip embedded in the platform is shown.

Related Organizations

Fraunhofer Institute for Reliability and Microintegration
Germany
Fraunhofer Society
Germany
Ericsson (Sweden)
Sweden
ERICSSON AB
Sweden

Keywords

PCB embedding, mobile communication system, integrated antenna, new radio, system-integration platform, antenna-in-package, base stations, 5G mmWave

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