Elastomer assisted Micro-Transfer-Printing (μTP) is a demonstrated and versatile micro-assembly technology that has been developed in a laboratory and an industrial environment for over ten years. μTP involves the release, transfer and printing of an array of devices from their growth substrate to a different non-native substrate in a massively parallel manner (i.e. thousands of devices per transfer) with a positioning tolerance less than 1.5 µm, using an elastomeric stamp as the transfer element. X-Celeprint has demonstrated this technology in a wide range of diverse applications spanning from OLED and micro-LED displays to concentrated photovoltaics, sensors, storage and photonics [1, 2]. This technology provides an excellent solution to challenges involving the heterogeneous integration of III-V devices with silicon and other application specific substrates such as engineered substrates, flexible substrates, CMOS wafers and glass substrates. Despite the transformational potential of μTP, no commercial facility is available to scale up the technology to an industrial production level in a microelectronics foundry environment. This paper will describe a European project, MICROPRINCE, that has the goal of setting up the worldwide first open access foundry pilot line for heterogeneous integration by μTP and demonstrate its capability on five defined target applications. The project includes 13 European partners and will be led by X-FAB MEMS Foundry GmbH, who will set up the pilot line in its cleanroom facilities. The installed pilot and the developed processes will lead to the unique opportunity to transfer R&D results to commercial exploitation. Companies planning to use the technology will now be able to use a foundry to have their products fabricated. This key element is expected to spur rapid adaption of the technology. The successful implementation is expected to lead to a substantial and sustainable growth of micro-assembly related businesses