
Cu3N layers with a thickness of 40 nm were deposited by reactive sputtering using Ar: 10% N2 and 100% N2, after which they were annealed under NH3/H2 between 300 and 500 °C. These exhibited distinc...
2.05 eV, 2.30 eV, Chemical Sciences not elsewhere classified, NH, energy maxima, Cell Biology, ultrafast pump-probe spectroscopy, Cu 3 N, bulk Cu 3 N, energy band gaps, Environmental Sciences not elsewhere classified, Medicine, Cu 3 N layers, Physical Sciences not elsewhere classified, Neuroscience, Biological Sciences not elsewhere classified, picosecond time scale
2.05 eV, 2.30 eV, Chemical Sciences not elsewhere classified, NH, energy maxima, Cell Biology, ultrafast pump-probe spectroscopy, Cu 3 N, bulk Cu 3 N, energy band gaps, Environmental Sciences not elsewhere classified, Medicine, Cu 3 N layers, Physical Sciences not elsewhere classified, Neuroscience, Biological Sciences not elsewhere classified, picosecond time scale
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