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A Non-Galvanic D-Band Mmic-To-Waveguide Transition Using Ewlb Packaging Technology-Dataset

Name: A Non-Galvanic D-Band Mmic-To-Waveguide Transition Using Ewlb Packaging Technology-Dataset
Keywords: eWLB, interconnects, waveguide transition,, millimeter waves, D-band

Research datakeyboard_double_arrow_right Dataset 04 Jun 2017Publisher:ZenodoFunded by:EC | M3TERA, EC | TERAMICROSYS

Authors: Hassona, Ahmed; He, Zhongxia Simon; Mariotti, Chiara; Dielacher, Franz; Vassilev, Vessen; Li, Yinggang; Oberhammer, Joachim; +1 Authors

doi: 10.5281/zenodo.822283 , 10.5281/zenodo.822282

A Non-Galvanic D-Band Mmic-To-Waveguide Transition Using Ewlb Packaging Technology-Dataset

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Abstract

This paper presents a novel D-band interconnect implemented in a low-cost embedded Wafer Ball Grid Array (eWLB) commercial process. The transition is realized through a patch slot antenna directly radiating to a standard waveguide opening. The interconnect achieves low insertion loss and good bandwidth. The measured minimum Insertion Loss (IL) is 2 dB and the average is 3 dB across a bandwidth of 22% covering the frequency range 110-138 GHz. In addition, the structure is easy to integrate as it does not require any special assembly nor any galvanic contacts. Adopting the low-cost eWLB process and standard waveguides makes the transition an attractive solution for interconnects beyond 100 GHz.

Related Organizations

Royal Institute of Technology
Sweden
Chalmers University of Technology
Sweden

Keywords

eWLB, interconnects, waveguide transition,, millimeter waves, D-band

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