The optimization of the cooling system of a mold from the company COPEFI was carried out to improve the warpage of the parts. First, an optimization of the process parameters was performed using the mold in production. A comparison between simulated and experimental work was made with the intend to validate the simulation method. Afterwards, a new design, using conventional straight-drilled channels, was performed, and studied utilizing simulation software (Moldex3D). Finally, a new design, using conformal cooling channels, was performed, and evaluated resorting to simulation software. To improve warpage, the process parameters chosen were: A – Mold Temperature, B – Injection Temperature, C – Injection Speed, D- Holding Pressure Time and E – Cooling Time. Regarding to the design optimization, the parameters chosen were: A – Diameter, B – Distance between cooling channels, C – Distance between cooling channels and the part, D – Mold material and E – Number of circuits. In both cases, Taguchi’s orthogonal array was used as the Design of experiments (DOE) tool. An orthogonal array of L16 (215) was performed for all the simulated models and an orthogonal array of L8 (27) was used for the experimental work. Analysis of Variance was performed to find the contribution of the processing parameters on the improvement of warpage. Globally it was found a strong contribution of cooling time and injection temperature on process parameters optimization. An increase of cooling time seemed to decrease warpage and with a decrease of injection temperature should decrease warpage as well. In the case of conventional optimization, mold material was the factor with more contribution to warpage. Comparing the three designs, conventional straight-drilled channels design had the best results to improve warpage with an improvement up to 14%.