The most significant progress in nanoimprint lithography has been made within the last 10 years. Various imprinting modes have been developed and some of them already reached a mature state for research and development environments. Tremendeous progress was seen in building up the infrastructure for NIL. Templates and related fabrication methods, resists and nanoimprinting equipment are commercially available nowadays. This was supported by the foundation of consortia supporting to enhance the infrastructure in NIL. A good example is NILCom, which was founded in 2004 and which aligns activities around the fabrication process for commercial devices. In addition, a number of potentially high volume future applications have been demonstrated, showing expected performances not only for high resolution patterning, but also for functional device integration. Imprinted micro lenses on up to 200 mm wafers are already in use in wafer-level optics for digital cameras. There are several nanoimprinting process modes available. Depending on the type of imprint material and available equipment either hot embossing or UV-NIL processes can be selected. Both types of processes can be performed with either hard template materials (e.g. Silicon, Quartz glass or Nickel) or soft working stamp materials. All of the described techniques have shown resolution capabilities of better than 50 nm. Hot embossing processes are the preferred process for structuring of polymer substrates directly. For devices with tight requirements on the overlay alignment accuracy hard UV-NIL is preferred. Thermal expansion differences of involved materials do not play any role as this process is performed at room temperature. Comparing to hard UV-NIL processes, soft UV-NIL is advantageous because of the possibility of patterning large area at once. Another benefit of soft UV-NIL is the fact that soft working stamps can be easily replicated from a master and each of them can be used for a large number of pattern replications. The risk of damaging the master due to mechanical means is largely reduced due to the soft properties of the working stamp materials. Considering the available infrastructure and the huge market potential, it can be assumed that a range of industrial applications will be realized by applying nanoimprint lithography processes.