Processes of high-frequency (HF) heating are examined and its parameters for the soldering of electronic modules are optimized. The advantages of HF heating are the following: selectivity by skin-effect; high density of energy; processing in any environment, including vacuum or inert gas; high ecological cleanliness, improvement solder flowing by electrodynamics forces increase the quality of soldering connections. Investigation of HF electromagnetic heating has allowed to optimize heating speed in local zones of soldering connections formation and to improve their quality due to joint action of superficial effects and electromagnetic forces.