Abstract Low pressure carburizing (LPC) in a vacuum furnace is increasingly the preferred method of case hardening for aerospace gears, and acetylene is often one of the gases used in the process. Selective case hardening is common with gears, where certain sections of a part are “stopped off” or “masked” to prevent carburization at those locations. For aerospace parts, the masking used is typically copper electroplating. The low pressures and high temperatures used in LPC lead to copper evaporation, which contaminates the vacuum furnace hot zone and components. In a worst-case scenario, deposited copper can lead to short-circuiting of power feedthroughs. This study looks at the effect of vacuum and partial pressure gases on copper evaporation and its application in production processes.