Abstract Copper/Invar/Copper is a wrought metallic composite material used in printed circuit boards, power planes, metal cores, hybrid enclosures, heat sinks, and other applications where coefficients of thermal expansion (CTE) match or where constraint of thermal expansion is required or beneficial. The laminated Cu/Invar/Cu composite material is metallurgically bonded by roll bonding and normally used in the fully annealed condition. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, and joining. Filing Code: FE-125. Producer or source: Engineered Materials Solutions Inc.