Heat is a by-product of any electronic circuit. It is unavoidable; however, an adequate thermal management system can protect thermal sensitive components from catastrophic failure. Thermal cloaking, based on thermal metamaterials, makes the thermal sensitive components invisible to thermal flow and protects them from overheating. This study developed two novel thermal metamaterials using the hybrid conduction-convection phenomena. The designed thermal metamaterials have two distinct properties. Firstly, it makes thermal sensitive components invisible within the cloak zone and protects them from heat flux. Secondly, it keeps the temperature in the cloak zone low for an extended duration which is not achievable by conventional thermal metamaterials. Using the designed thermal metamaterials, any thermal sensitive components can be protected from overheating and perform at their optimum even during extensive computations. The first thermal metamaterial design is based on natural convection-assisted thermal cloaking, whereas the other is based on forced convection-assisted thermal cloaking. Experiments were used to validate the simulation results under natural convection, corresponding to the simulation assumptions. Results showed that the temperature within the cloak region could be reduced by up to 15oC. At the same time, the heat source remains at 100oC and the heat sink at 0oC, from ~50oC with traditional cloaking to 35oC with the developed hybrid conduction-convection thermal metamaterial. It is worth mentioning that the experimental results matched well with the FEM simulation results. Another contribution of this study is the incorporation of the proposed hybrid conduction-convection thermal metamaterial (natural convection based) onto a printed circuit board (PCB). Its performance is evaluated using a custom-designed temperature sensor circuit. One sensor is shielded by thermal cloaking, while the other is left exposed. Experiments were carried out under both open and closed cover conditions. Due to the novel and optimized thermal metamaterial, the sensor placed within the cloaked region remained at a low temperature of around 37oC compared to the open sensor at about 48oC in the enclosed box. Furthermore, a novel optimisation approach is devised using the Conjugate gradient method (CGM) and adjoint equations. It is used to solve the inverse heat conduction problem (IHCP) and predict anisotropic thermal conductivity distribution for perfect thermal cloaking. Using the optimisation algorithm, a squared shape thermal cloak with uniform and consistent temperature below 30oC was achieved within the first ten iterations with excellent stability. Unlike coordinate transformation, this approach offered a novel thermal metamaterial independent of the base material's thermal conductivity and the cloak's shape. This study provided novel thermal metamaterial designs that can realize thermal cloaking while keeping the temperature in the cloak zone within a safe range, particularly for thermal sensitive components. It is expected to shift thermal cloaking closer to being used in advanced electronic devices such as laptops, smartphones, electric cars, drones, etc.