The project was undertaken to determine the characteristics of thick film conductors that affect thermocompression bonding. Thick film inks were analyzed to determine compositional characteristics that could be used as acceptance criteria. Analytical methods evaluated included thermogravimetric analysis, pyrolysis gas chromatography, infrared spectrophotometry, mass spectrometry, atomic absorption spectrophotometry, scanning electron microscopy with energy dispersive x-ray spectroscopy, and an electronics counter. The effects of bonding force and substrate temperature versus bond strength were evaluated for three thick film conductor materials which had been fired at various times and temperatures. Conductor resistance was also evaluated. The scanning electron microscope with energy dispersive x-ray spectroscopy was used for the analysis of fired films.