Thermal Reaction Characterization of an Epoxy Molding Compound

descriptionPublicationkeyboard_double_arrow_right Article 01 Jan 2001Publisher:Springer Science and Business Media LLCJournal:Polymer Journal, volume 33, pages 49-53 (issn: 0032-3896, eissn: 1349-0540,

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Authors: Lu, Man Geng; Choi, Hyeong-Ki; Lee, Hong-Ki; Shim, Mi-Ja; Kim, Sang Wook;

doi: 10.1295/polymj.33.49

Thermal Reaction Characterization of an Epoxy Molding Compound

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Abstract

A novel epoxy molding compound for electronic industry application was used to conduct thermal analysis characterization using differential scanning calorimetry (DSC) and thermogravimetric analyzer (TGA). The reaction kinetics of cure and thermal degradation have been analyzed based on a proposed iso-conversional model. The kinetic results showed that the cure and decomposition process are complex, and the values of activation energy are dependent on the degree of conversion.

Related Organizations

Seoul National University
Korea (Republic of)
Woosuk University
Korea (Republic of)
University of Seoul
Korea (Republic of)

Keywords

Epoxy Molding Compound, Cure Kinetics, Thermal Degradation, Iso-Conversional Model

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