A Review of Hydrophilic Silicon Wafer Bonding

descriptionPublicationkeyboard_double_arrow_right Article 01 Jan 2014 English Publisher:The Electrochemical SocietyJournal:ECS Journal of Solid State Science and Technology, volume 3, pages Q42-Q54 (issn: 2162-8769, eissn: 2162-8777,

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Authors: Masteika, V.; Kowal, J.; Braithwaite, N. St.J.; Rogers, T.;

doi: 10.1149/2.007403jss

A Review of Hydrophilic Silicon Wafer Bonding

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Abstract

Hydrophilically activated direct wafer bonding is a technique for gluelessly attaching oxide-coated wafers together. This ability is a vital step in the construction of many microelectronic and microelectromechanical (MEMS) devices. In particular this technique is widely used in the production of 3d interconnected devices due to the lack of interlayer.

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