Previous work on welding of optical materials with ultrashort laser pulses demonstrated that the ability to achieve good contact between components limits the applicability of the technology to only very small components. We have overcome this limitation and demonstrated the capability to weld similar and dissimilar materials using femtosecond laser pulses over several mm 2 areas between intimately contacted surfaces. Our joining process is realised in two steps. Firstly, the two pieces which must be joined are direct bonded, thereby inducing optical contact throughout the whole potentially bondable surface. Subsequently, the direct bond is reinforced by the inscription of femtosecond laser weld seams in a sealing pattern in order to enclose the central region of the direct bond. We demonstrated the applicability of this process to identical glass, dissimilar glass and glass-semiconductor. We also measured a mean threefold increase in joint strength for such bonds between fused silica windows with only a few welding seams. The final assembly is free from macroscopic surface deformations. Furthermore, by optimizing the laser exposure parameters, we can avoid microscopic defects inside and around weld seams. Finally, the bonding method does not alter the optical transmission properties at the center of the sealed region. As opposed to the use of adhesives, such bonds resist to important thermal constraints and are free from chemical contaminants, degassing and ageing. Potential applications may be considered in the fields of aerospace, laser manufacturing, semiconductor industry, solar cell protection, precision manufacturing and many more.