
Capacitive micromachined ultrasonic transducers (CMUTs) have great potential to compete with piezoelectric transducers in high-power applications. As the output pressures increase, nonlinearity of CMUT must be reconsidered and optimization is required to reduce harmonic distortions. In this paper, we describe a design approach in which uncollapsed CMUT array elements are sized so as to operate at the maximum radiation impedance and have gap heights such that the generated electrostatic force can sustain a plate displacement with full swing at the given drive amplitude. The proposed design enables high output pressures and low harmonic distortions at the output. An equivalent circuit model of the array is used that accurately simulates the uncollapsed mode of operation. The model facilities the design of CMUT parameters for high-pressure output, without the intensive need for computationally involved FEM tools. The optimized design requires a relatively thick plate compared with a conventional CMUT plate. Thus, we used a silicon wafer as the CMUT plate. The fabrication process involves an anodic bonding process for bonding the silicon plate with the glass substrate. To eliminate the bias voltage, which may cause charging problems, the CMUT array is driven with large continuous wave signals at half of the resonant frequency. The fabricated arrays are tested in an oil tank by applying a 125-V peak 5-cycle burst sinusoidal signal at 1.44 MHz. The applied voltage is increased until the plate is about to touch the bottom electrode to get the maximum peak displacement. The observed pressure is about 1.8 MPa with -28 dBc second harmonic at the surface of the array.
Bottom electrodes, Receive Performance, Array elements, Ultrasonic transducers, Experimental verification, Oil tanks, Receive performance, Sinusoidal signals, Gap height, equipment design, Models, Circuit, Fabrication process, Electric Impedance, Radiation Impedance, Improved transmit, Non-Linearity, Operation, Ultrasonography, instrumentation, Improved Transmit, Dual-electrode structure, Radiation impedance, Thick plate, electronics, theoretical model, article, Feasibility, Equipment Design, Design approaches, transducer, High power applications, High output, Second harmonics, Peak displacement, Micromachined ultrasonic transducers, Optimization, Anodic bonding process, Design, Transducers, Harmonic distortion, Natural frequencies, Silicon wafers, TK Electrical engineering. Electronics Nuclear engineering, Dual-electrode Structure, Medical, computer simulation, Computer Simulation, Continuous-wave signals, Equivalent circuit model, Membranes, Substrates, Full-swing, Capacitive micromachined ultrasonic transducer, Silicon plates, Array, echography, 621, Models, Theoretical, Micromachined Ultrasonic Transducers, Optimized designs, Electronics, Medical, Glass substrates, Mode of operations, impedance, Applied voltages, Fabricated arrays, High-power
Bottom electrodes, Receive Performance, Array elements, Ultrasonic transducers, Experimental verification, Oil tanks, Receive performance, Sinusoidal signals, Gap height, equipment design, Models, Circuit, Fabrication process, Electric Impedance, Radiation Impedance, Improved transmit, Non-Linearity, Operation, Ultrasonography, instrumentation, Improved Transmit, Dual-electrode structure, Radiation impedance, Thick plate, electronics, theoretical model, article, Feasibility, Equipment Design, Design approaches, transducer, High power applications, High output, Second harmonics, Peak displacement, Micromachined ultrasonic transducers, Optimization, Anodic bonding process, Design, Transducers, Harmonic distortion, Natural frequencies, Silicon wafers, TK Electrical engineering. Electronics Nuclear engineering, Dual-electrode Structure, Medical, computer simulation, Computer Simulation, Continuous-wave signals, Equivalent circuit model, Membranes, Substrates, Full-swing, Capacitive micromachined ultrasonic transducer, Silicon plates, Array, echography, 621, Models, Theoretical, Micromachined Ultrasonic Transducers, Optimized designs, Electronics, Medical, Glass substrates, Mode of operations, impedance, Applied voltages, Fabricated arrays, High-power
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