The CMOS implementation of RF-transceivers for 2G/3G mobile communication standards allows the integration of base-band and RF functions on a single chip at significantly reduced manufacturing cost. Complex RF circuit architectures are now possible, which could not be realized economically before in a mixed bipolar/CMOS technology. This development not only demands for new test methods, but also paves the way for novel test concepts and strategies for a more cost efficient RF test in production. Some aspects of this trend which became apparent during the development of such RF transceivers are discussed and examples are presented of how not only to meet the new demands but also to take benefit of them.