A package design for a 10 kV IGBT press pack module with series connected chips was developed. IGBT press pack modules with internal series or antiseries connection are offering new opportunities and potential cost savings in different applications. The proposed package design is presented for both series as well as antiseries connection. The main technical challenges, such as current management, thermal management, pressure management and high voltage management are described and their solutions are discussed. With such a package, a higher level of integration can be reached.