It is well known that as the size of microprocessors decreases with respect to Moore's law, cooling issues have become more predominant and critical for the electronics industry. One source of thermal resistance requiring more characterization is Thermal Interface Materials, TIMs. Thermal interface materials, such as greases, elastomeric pads, thermal tapes, phase change materials, gels, thermally conductive adhesives and solder, are used in a variety of electronic and microelectronic engineering applications. Currently in industry, TIM testers are modeled after ASTM D 5470, "Standard Test Method for Steady-State Thermal Transmission Properties of Thermally Conductive Solid Electrical Insulation Material". ASTM D 5470 uses two metal blocks, one heated and one cooled, between which a TIM is placed. Temperature sensors are placed within the metal blocks. Since the temperature distribution is linear, the temperature of surface of the metal blocks in contact with the specimen can be calculated using the sensor-given temperatures and the distance between the sensors. The concept of ASTM D 5470 is very simple; however, there are many problems with the standard including repeatability issues, contamination problems, pressure concerns and measurement inaccuracies (Gwinn Reference). In fact, the thermal characteristics or properties of TIMs vary significantly from a "standardized" environment based on ASTM D 5470 to a real application situation, in-situ. A new device is designed which modifies the ASTM standard for an industry environment taking into account both high and low pressures as well as the concerns expressed above.