Impinging jet is one of the ideal schemes to satisfy the heat dissipation requirement of the high power chips. In this research, experiments are carried out to investigate the heat transfer between the straight impinging jet array and an iso-heat-flux simulant chip (a heated epoxy resin plate). In the heat transfer experiments, two kinds of jet array are considered, the circular array and the four square array. In some range of flux of the air jet and nozzle-to-plate spacing, the influence of the different arrangement of the spout on average heat transfer of the target plate is discussed. Furthermore, the heat transfer effect of the jet array is compared to the single orifice nozzle which has the same flow area with the array nozzle. Meanwhile, numerical simulation is performed to study the heat transfer effect of the swirling impinging jet in this paper. The angular velocity of the swirling jet, the flow Reynolds number, the dimension of the nozzle and the nozzle-to-plate spacings are examined, then the distribution of both local and average heat transfer coefficient (Nusselt number) on the simulant chip is obtained.