Miniaturization has become a prime design goal especially for airborne electronic components. Generally, this means increased electrical stresses which require both redesign of the insulation system and the introduction of improved materials. To meet these dielectric strength requirements, there has been increased reliance on epoxy embedding compounds. As in the case of any relatively new insulation concept, there is a tremendous need for additional design data. This is especially true in the case of dielectric strength since much of the available data is difficult to relate to a completely solid insulation system.