This paper describes methodologies on how to enhance solder joint reliability in electronic automotive modules to meet harsh field environments. The reliability enhancement of a QFN component has been investigated and results are presented. The first step is to optimize the PCBpad including dividing center pad areas underneath the package. The second aspect is to use corner bond or underfill. Several types of glue materials have been tested and the effectiveness of the reliability enhancement has been demonstrated. A new way to solve the reliability issue is presented which uses organic substrate as base for QFN. The reliability test by thermal cycling was performed and finite element analysis (FEA) has been employed to understand the mechanism of those design changes. The results show that corner bond material is very effective in reliability enhancement.