A new approach to flip chip package with hybrid packaging technologies is presented, which will be pretty much promising package solution as a large size FC-BGA (flip chip ball grid array) for SOC (system on a chip). The proposed new approach can be utilized to enhance power integrity and heat spreading and to reduce the FC-BGA package height with keeping and not degrading the mechanical property of conventional FC-BGA. The presented new package based on hybrid approach is implemented by the combination of thick-core based substrate and thin-core (or coreless) substrate. While most of area in package is mechanically supported by 800um thick core, SOC die is mounted on thin substrate by proper flip chip bonding. The interconnection between thick-core based substrate and thin-core (or coreless) substrate is achieved by wire bonding by conventional packaging process or RDL (redistribution layer) by fan-out package technology. Comparative study on the proposed new structure with conventional FCBGA is presented in terms of power integrity, signal integrity, and thermal resistance. Through several case studies, it is demonstrated that the presented hybrid approach is an adequate package solution for cost-effective thin FCBGA enhancing power integrity and thermal performance.