Thermally enhanced flip-chip BGA with organic substrate

H. Matsushima; S. Baba; Y. Tomita; M. Watanabe; E. Hayashi; Y. Takemoto

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Article . 2002 . Peer-reviewed

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Thermally enhanced flip-chip BGA with organic substrate

descriptionPublicationkeyboard_double_arrow_right Article 27 Nov 2002Publisher:IEEEJournal:1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)

Authors: H. Matsushima; S. Baba; Y. Tomita; M. Watanabe; E. Hayashi; Y. Takemoto;

doi: 10.1109/ectc.1998.678772

Thermally enhanced flip-chip BGA with organic substrate

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Abstract

A thermally enhanced Flip-chip BGA package (FC-BGA) with organic substrate has been developed. The package is proud of the high thermal and electrical performance due to the flip-chip interconnections, and the optimized heat spreader attached directly on to the die. Besides, the eutectic solder bumps (Pb63wt% Sn) have realized high reliability of flip-chip interconnections, compared with the high melting point solder bumps (Pb-3wt% Sn connected with Pb-63wt% Sn).

Related Organizations

Mitsubishi Electric (Germany)
Germany
Mitsubishi
Japan

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