A nano-composite polyamide imide passivation for 10 kV power electronics modules

descriptionPublicationkeyboard_double_arrow_right Article , Conference object 01 Sep 2012Publisher:IEEEJournal:2012 IEEE Energy Conversion Congress and Exposition (ECCE)

Authors: Zhou, Jinchang; Ang, Simon; Mantooth, Alan; Balda, Juan C.;

doi: 10.1109/ecce.2012.6342243

A nano-composite polyamide imide passivation for 10 kV power electronics modules

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Abstract

High current and voltage handling capabilities are desired in many high-performance power electronic modules. One of the main challenges when integrating a power module is having a high-voltage insulation material that is reliable at all operating temperatures. In this work, the use of a polyamide imide (PAI) material as the high-voltage passivation for the power electronic modules was investigated. The power modules were integrated with a two-step passivation-encapsulation process using the PAI material. The fabricated modules were tested up to 10 kV to evaluate the material insulation properties.

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