The wire drawing process of Polycrystalline diamond (PCD) wire drawing die is simulated by ABAQUS FEA software, which is used in drawing solar wafer cutting wire. According to the requirements of structure and sizes of shaper hole in the actual production, the wire drawing die whose reduction angle is 8 degrees is used in this simulation firstly. And the axial stress distribution and maximum axial tensile stress curve of cutting wire, and the equivalent stress distribution and equivalent stress curve of PCD drawing die can be obtained. From the stress curve of PCD drawing die, it can be seen that the equivalent stress maximum of die blank is 5826Mpa. Finally, several wire drawing die with different reduction angles are simulated to analyze the effects of different reduction angles on drawing force in theory. This simulation on PCD wire drawing die provides some theoretical basis for the design of reduction angle.