Numerical simulation of coupled transient electrothermal fields with the meshless RPIM

descriptionPublicationkeyboard_double_arrow_right Article 01 Jun 2016Publisher:IEEEJournal:2016 IEEE International Symposium on Antennas and Propagation (APSURSI)

Authors: Xiaoyan Zhang; Zhizhang David Chen; Yiqiang Yu;

doi: 10.1109/aps.2016.7696021

Numerical simulation of coupled transient electrothermal fields with the meshless RPIM

- Summary
- Metrics

Abstract

It is well known that Joule heat losses in integrated circuits (ICs) may change electrical behaviors of devices, especially semiconductor components. In this paper, a meshless approach based on a radial point interpolation method (RPIM) is developed to numerically model the coupled electrical-thermal process in time domain. The effectiveness of the proposed RPIM is verified through simulation of thin-film resistors.

Related Organizations

University of Electronic Science and Technology of China
China (People's Republic of)
East China Jiaotong University
China (People's Republic of)
Dalhousie University
Canada

Impact byBIP!

	selected citations These citations are derived from selected sources. This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).	0
	popularity This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.	Average
	influence This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).	Average
	impulse This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.	Average