The Power Chips technology employs a gap of 4–10 nanometers in a gap diode to allow for efficient thermal conversion with very low thermal leakage. The design ΔT is on the order of 400 degrees single stage, with operation possible from 1 K to 1600 K, depending on configuration and meeting engineering challenges. Efficiency is projected to be in the range of 70% of Carnot‐defined maximum. RD thin film and packaging issues remain. The technology is anticipated to be ideal in terms of size, weight, efficiency, and reliability. Power Chips can be packaged identically as conventional thermoelectrics making them a drop‐in replacement in many cases including RTGs. Applications for Power Chips include RTGs as well as thermal conversion from a waste heat stream or solar‐thermal conversion. This paper was originally published without all of the proper acknowledgments.