CMOS–MEMS integration today and tomorrow

descriptionPublicationkeyboard_double_arrow_right Article 01 Nov 2008 English Publisher:Elsevier BVJournal:Scripta Materialia, volume 59, pages 945-949 (issn: 1359-6462,

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Authors: Ann Witvrouw;

doi: 10.1016/j.scriptamat.2008.06.043

CMOS–MEMS integration today and tomorrow

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Abstract

Abstract The integration of complementary metal oxide semiconductor (CMOS) and microelectromechanical systems (MEMS) can improve the performance of the MEMS, allows for smaller packages and leads to a lower packaging and instrumentation cost. Polycrystalline silicon–germanium (poly-SiGe) has already shown its potential for integrating MEMS and CMOS in a MEMS-last approach. The current state-of-the-art for poly-SiGe MEMS integration and the needs for the future will be addressed in this article. Market trends are translated into a roadmap for MEMS integration.

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Katholieke Universiteit Leuven
Belgium

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