The ongoing trend in the Microtechnology field reflects a further increase of the product miniaturization and in the same time shortened lifetime cycles. These aspects are the basis for the development of new packaging and interconnection concepts with increased efficiency and reliability. The state-of-the-art to control and monitor crucial process steps includes the use of human operators generating this way high personnel costs. Combining flexible mounting and joining tools with progressive process monitoring strategies new production facilities can be established. Following this concept a semi-automatic prototype production cell for packaging and interconnection of optical and electro-optical microsystems has been developed. In order to prove the performances of the prototype production cell the mounting and assembly of cuboid shape components, consisting of optical transparent or semi-conducting materials, has been defined as demonstrative application. The joined cuboids have the contact surface precisely delimited in functional and joining area. The particularities of the joining area (small dimensions and limited access) and the well-known advantages of the laser material processing make the laser beam soldering the most suitable joining process for this application.