Technology tools for a high precision accelerometer in bulk micromechanics

descriptionPublicationkeyboard_double_arrow_right Article 01 Oct 1994 English Publisher:Springer Science and Business Media LLCJournal:Microsystem Technologies, volume 1, pages 10-13 (issn: 0946-7076, eissn: 1432-1858,

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Authors: T. Geßner; E. Vetter; M. Wiemer;

doi: 10.1007/bf01367755

Technology tools for a high precision accelerometer in bulk micromechanics

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Abstract

The high precision accelerometer consists of 5 silicon wafers and packages by silicon fusion bonding. The sensor has a capacitance measuring principle and works in an open loop or closed loop operation mode. The etching process for the realization of thin beams and seismic mass, the silicon fusion bonding and the metallization process are described.

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Chemnitz University of Technology
Germany

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