
doi: 10.1007/bf00363357
The effect of different (0.5, 2 and 4 keV) Ar+ energy ions on (a) the composition of an FeSi surface, (b) the oxidation of the FeSi surface after bombardment, and (c) the segregation of silicon after bombardment, has been monitored by Auger electron spectroscopy. Silicon was found to be preferentially sputtered by the Ar+ ions at all the different energies during bombardment. This effect was more pronounced at the 0.5 keV ion energy bombardment. There was a slight increase in the oxidation rate from the higher to the lower Ar+ ion energy at which the sample was sputtered before oxidation. The rate of silicon diffusion to the surface at 593 K after the sample had been sputtered, was lower when the sample had been sputtered by 0.5 keV ions than by 2 keV ions.
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