Heat dissipation has become a key issue in electronic devices with high integration and miniaturization. As an effective way of heat transfer, radiative cooling has aroused a great attention in these devices. However, heat dissipation based on radiative cooling coating is limited by the poor heat spreading and temperature nonuniformity. Herein, a synergic augment strategy of excellent thermal conduction and strong thermal emission is proposed to improve the heat dissipation and temperature uniformity of radiative cooling coating. By the strategy, a composite coating consisting of poly(vinylidene fluoride‐co‐hexafluoropropene) and graphite is designed. It is shown via experiment that heat dissipation in composite coating is enhanced by 7% during daytime. A large temperature reduction of about 15.5 °C is obtained at the surface of the heat source with a composite coating during daytime. The temperature difference of the surface for composite coating within 2 °C demonstrates that the temperature uniformity of radiative cooling coating is improved.