
AbstractA galvanostatic pulse plating model is presented for the electrodeposition of an alloy on a rotating disk electrode. This model is used to simulate the electrodeposition of nickel/chrome alloys. The mass transport equations used in the model include the effects of diffusion, migration and convection; and the electrode kinetics are described by the Butler‐Volmer equation. It is predicted that the effect of ionic migration is significant and therefore should be included in models of pulse plating.
Engineering, kinetics, Transport Phenomena, Chemical Engineering, electrochemical electrodes, 530, Butler-Volmer equation, 510
Engineering, kinetics, Transport Phenomena, Chemical Engineering, electrochemical electrodes, 530, Butler-Volmer equation, 510
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