
Methods are required to monitor the composition and ageing of thechemicals used in copper electroplating baths in order to better guaranteethe quality of the deposited copper. We have used electrochemicalimpedance spectroscopy measurements on copper interconnect depositionbaths in a wafer fab to characterize changes in the condition of those baths.The method is able to clearly distinguish between tools using differentplating chemistries. Results from experiments to monitor multiple processtools indicate the shape of the impedance scan is sensitive to changes in thesteady state of the bath chemistry and may be an indicator of overall bath quality
[CHIM] Chemical Sciences, [SPI.TRON] Engineering Sciences [physics]/Electronics
[CHIM] Chemical Sciences, [SPI.TRON] Engineering Sciences [physics]/Electronics
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