
The \emph{MIDNA} application specific integrated circuit (ASIC) is a skipper-CCD readout chip fabricated in a 65 nm LP-CMOS process that is capable of working at cryogenic temperatures. The chip integrates four front-end channels that process the skipper-CCD signal and performs differential averaging using a dual slope integration (DSI) circuit. Each readout channel contains a pre-amplifier, a DC restorer, and a dual-slope integrator with chopping capability. The integrator chopping is a key system design element in order to mitigate the effect of low-frequency noise produced by the integrator itself, and it is not often required with standard CCDs. Each channel consumes 4.5 mW of power, occupies 0.156 mm${^2}$ area and has an input referred noise of 2.7${μν}_{rms}$. It is demonstrated experimentally to achieve sub-electron noise when coupled with a skipper-CCD by means of averaging samples of each pixel. Sub-electron noise is shown in three different acquisition approaches. The signal range is 6000 electrons. The readout system achieves 0.2${e^{-}}$ RMS by averaging 1000 samples with MIDNA both at room temperature and at 180 Kelvin.
Artificial intelligence, Chip, Aerospace Engineering, FOS: Mechanical engineering, FOS: Physical sciences, Noise (video), Applied Physics (physics.app-ph), Engineering, CMOS Image Sensor Technology, https://purl.org/becyt/ford/2.2, CMOS Image Sensors, FOS: Electrical engineering, electronic engineering, information engineering, Image (mathematics), Amplifier, https://purl.org/becyt/ford/2, Electrical and Electronic Engineering, Optoelectronics, Radiometric Calibration and Performance Monitoring, Infrared Small Target Detection and Tracking, CORRELATED DOUBLE SAMPLING, Time delay and integration, Dynamic range, CRYOGENIC, Electronic engineering, Physics, CMOS, Integrator, Optics, Voltage, Physics - Applied Physics, Computer science, LOW NOISE, Programming language, Application-specific integrated circuit, Pixel-Level ADC, Channel (broadcasting), SIGNAL (programming language), Electrical engineering, Physical Sciences
Artificial intelligence, Chip, Aerospace Engineering, FOS: Mechanical engineering, FOS: Physical sciences, Noise (video), Applied Physics (physics.app-ph), Engineering, CMOS Image Sensor Technology, https://purl.org/becyt/ford/2.2, CMOS Image Sensors, FOS: Electrical engineering, electronic engineering, information engineering, Image (mathematics), Amplifier, https://purl.org/becyt/ford/2, Electrical and Electronic Engineering, Optoelectronics, Radiometric Calibration and Performance Monitoring, Infrared Small Target Detection and Tracking, CORRELATED DOUBLE SAMPLING, Time delay and integration, Dynamic range, CRYOGENIC, Electronic engineering, Physics, CMOS, Integrator, Optics, Voltage, Physics - Applied Physics, Computer science, LOW NOISE, Programming language, Application-specific integrated circuit, Pixel-Level ADC, Channel (broadcasting), SIGNAL (programming language), Electrical engineering, Physical Sciences
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