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INVESTIGATION OF ANISOTROPIC PROPERTIES OF THERMAL INSULATION

descriptionPublicationkeyboard_double_arrow_right Article 13 Dec 2022Publisher:Zenodo
Authors: M.A. Spiridonov; D.E. Nikulina; P.V. Yakovlev;

doi: 10.5281/zenodo.7434639 , 10.5281/zenodo.7434640

INVESTIGATION OF ANISOTROPIC PROPERTIES OF THERMAL INSULATION

Abstract

This article is devoted to the study of a thermal diode. Since a significant amount of heat loss is carried out through cracks, cracks in buildings, with poorly selected thermal insulation, it is necessary to use the heat difference between ambient temperatures and indoor temperatures most effectively. The research was carried out using the SolidWorks software product and the Fluke Ti400 thermal imager.

Keywords

thermal insulation, thermal resistance, «thermal diode», temperature pressure, thermal protection

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selected citations
These citations are derived from selected sources.
This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Citations provided by BIP!
popularity
This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.
BIP!Popularity provided by BIP!
influence
This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Influence provided by BIP!
impulse
This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.
BIP!Impulse provided by BIP!
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