High-efficiency cooling via the monolithic integration of copper on electronic devices

descriptionPublicationkeyboard_double_arrow_right Article 02 May 2022 English Publisher:Springer Science and Business Media LLCJournal:Nature Electronics, volume 5, pages 394-402 (eissn: 2520-1131,

Copyright policy )Funded by:NSF | Engineering Research Cent...

Authors: Gebrael, Tarek; Li, Jiaqi; R. Gamboa, Arielle; Ma, Jingcheng; Schaadt, Joseph; Horowitz, Logan; Pilawa-Podgurski, Robert; +1 Authors

doi: 10.1038/s41928-022-00748-4 , 10.5281/zenodo.6339606 , 10.5281/zenodo.6339607 , 10.5281/zenodo.6471515

High-efficiency cooling via the monolithic integration of copper on electronic devices

- Summary
- Metrics

Abstract

This is the repository of source files used in the article: High efficiency cooling via the monolithic integration of copper on electronic devices. According to the guidance of Nature Electronics, we upload source files to a public repository. In detail, Data.zip contains the data used to plot Figures 1, 3, 4 and 5. SD_Analysis.m contains the MATLAB script used to compute the spreading depth and thermal resistance (Figures 4b and 4c). Ansys_TempCycle_Input.zip contains Ansys input files used to compute the strain energy density and von Mises stress (Figure 5). Icepak_AsymSpread_Input.zip contains Ansys Icepak input files used to compute the spreader thermal resistance (Supplementary Figure S9) for one representative case. Input files for other cases are available from the corresponding author on reasonable request.

Related Organizations

University of California, Berkeley
United States
Kyushu University
Japan
University of Illinois at Urbana Champaign
United States

Impact byBIP!

	selected citations These citations are derived from selected sources. This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).	72
	popularity This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.	Top 1%
	influence This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).	Top 10%
	impulse This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.	Top 1%