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handle: 10044/1/84661
The data released here is for the paper "In-situ study of creep in Sn-3Ag-0.5Cu solder". DOI: 10.1016/j.actamat.2020.06.013 Tianhong Gu1*, Vivian S. Tong1,2, Christopher M. Gourlay1, and T. Ben Britton1 Department of Materials, Imperial College London, SW7 2AZ. UK Now at: National Physical Laboratory, Hampton Rd, Teddington TW11 0LW, UK *Corresponding author: t.gu15@imperial.ac.uk, +44 20 7594 2634 *.bcf = Bruker BCF data for full EBSD map to plot EBSD maps *.csv = spreadsheet of graphical data for plots in Fig2 (creep curves), Fig10 and Fig11 (Schmid factors and slip systems) *.tif = images used to to build up Figures (the figures are presented in the powerpoint) The data bundle was prepared by Tianhong Gu
Recrystallisation, Pb-free solder, Microstructure evolution, 620, 543
Recrystallisation, Pb-free solder, Microstructure evolution, 620, 543
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