Semiconductor packages has become dynamic in terms of application and its package architecture. Packages were designed to become thinner and with advance capability. In lieu to the need of thinner packages, its architecture has changed to adopt the requirement. Dicing before grinding have been developed to cater thinner dies. Dicing on a full wafer thickness needed an accurate blade height. In addition, new processes such as partial cutting prior package Singulation have been developed to adopt to the emerging needs of higher bond level reliable products. Similar to dicing before grinding, partial cutting needed an accurate blade height. In order to achieve accurate blade height, process solutions such as chopper cut set-up have been introduced.