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Flexibilitatea actuală a mărfurilor înseamnă a fabrica produse la preţuri rezonabile, de înaltă calitate, care pot fi livrate rapid clienţilor. Sistemele microelectromecanice MEMS constau din elemente mecanice, senzori, dispozitive de acţionare și dispozitive electrice și electronice pe un substrat comun de siliciu. Senzorii din MEMS colectează informaţii din mediul prin măsurarea fenomenelor mecanice, termice, biologice, chimice, optice și magnetice. În articol sunt analizate probleme legate de fizica și a statistica generării defectelor pentru a investiga limitele finale de fiabilitate pentru nanodispozitive. Industria MEMS este prezentă într-o poziţie mult mai vulnerabilă decât pare, indiferent de cât de minunat ar putea să arate viitorul ei. Extinderea cunoștinţelor despre fizica eșecului va permite îmbunătăţirea fiabilităţii acestora și dezvoltarea metodelorde testare accelerate. Cea mai mare provocare o constituie producţia eficientă din punct de vedere al costurilor.
Today flexibility means to produce reasonably priced customized products of high quality that can be quickly delivered to customers. The article analyses issues related to physic, able to generating defects, affecting the reliability limits for MEMS Micro-Electro-Mechanical Systems. The MEMS industry is currently at a much more vulnerable position than it appears, regardless of how wonderful its future may look like. A full understanding of the physics and statistics of the defect generation is required to investigate the ultimate reliability limitations for nanodevices. Biggest challenge: cost effective, high volume production.
MEMS switches, Erori de proces, defecte ambalare, Process errors, mecanisme de detectare eșec, creep, fluaj, analiza defecţiunilor, reliability, MEMS optic, întrerupătoare MEMS, QA75.5-76.95, Engineering (General). Civil engineering (General), optical MEMS, failure analysis, predicţie de viaţă, MEMS, Electronic computers. Computer science, fiabilitate, TA1-2040, lifetime prediction, package cracking, failure mechanisms
MEMS switches, Erori de proces, defecte ambalare, Process errors, mecanisme de detectare eșec, creep, fluaj, analiza defecţiunilor, reliability, MEMS optic, întrerupătoare MEMS, QA75.5-76.95, Engineering (General). Civil engineering (General), optical MEMS, failure analysis, predicţie de viaţă, MEMS, Electronic computers. Computer science, fiabilitate, TA1-2040, lifetime prediction, package cracking, failure mechanisms
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