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In the paper, a stress-strain detection method is used by correlation point interferometry, in which the resolution of the recording surface changes has been significantly (ten times) improved. This result was obtained by applying a different image-processing algorithm, which allows the recording of 3D surface changes in on-line mode. The deformation wave that occurs during heating propagates through the entire sample and interacts with the interfaces. The inhomogeneity and residual deformations of a material lead to a distortion of the front. The speckle electron interferometry (ESI) method allows the recording of this thermal deformation wave front and the estimation of the stress state of the studied material.
stress strain, Electronic computers. Computer science, heterogeneous materials, speckle electron interferometry (ESI), QA75.5-76.95, TA1-2040, Engineering (General). Civil engineering (General), thermal deformation wave
stress strain, Electronic computers. Computer science, heterogeneous materials, speckle electron interferometry (ESI), QA75.5-76.95, TA1-2040, Engineering (General). Civil engineering (General), thermal deformation wave
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