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Conference object
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Multi-Wire Module Modeling, Measuring and More

descriptionPublicationkeyboard_double_arrow_right Conference object Under curation English Publisher:ZenodoFunded by:EC | SHINE+PV
Authors: Govaerts, Jonathan; Reekmans, Bart; Javanbakht Lomeri, Hamed; Borgers, Tom; Mahajan, Mihir; Depauw, Valérie; Sivaramakrishnan Radhakrishnan, Hariharsudan;

doi: 10.5281/zenodo.23096878

Multi-Wire Module Modeling, Measuring and More

Abstract

Objective: Understanding impacts of Ag finger metallization and Cu interconnect wire layout on performance and materials.

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