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Multiscale Dynamics in Wafer Bonding: Mechanisms Driving the Bond Front (Session 1: Fundamentals)

descriptionPublicationkeyboard_double_arrow_right Conference object Under curationPublisher:imecFunded by:EC | NanoIC
Authors: Jain, Utkarsh; Brems, Steven; Phommahaxay, Alain;

doi: 10.5281/zenodo.20508054

Multiscale Dynamics in Wafer Bonding: Mechanisms Driving the Bond Front (Session 1: Fundamentals)

Abstract

Slides presented in Chemnitz at conference "Waferbond '25" on 3 Dec 2025

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