We present a scalable pathway to room-temperature superconductivity in ordinary copper using the Elastic Membrane Cosmology (EMC) framework. Conven-tional approaches rely on exotic materials and extreme conditions because they treat resistance as an electron-phonon problem. EMC reveals a deeper origin: resistancearises from geometric impedance mismatch between the electron wavefunction andthe 5D spatial lattice.By applying the EMC impedance equation Zeff = Z0 cos2 θ, we show that copper’s native FCC lattice inherently produces non-orthogonal coupling. We propose anovel THz Acoustic Metallurgy protocol: during recrystallization (400–600◦C),a 7.2 THz phased-array standing wave (Chladni interference) forces the copperatoms into a metastable hexagonal symmetry. This geometry locks the electronic pathways at θ = 90◦, driving ZEMC → 0.The resulting metastable Hex-Cu exhibits zero spatial impedance, enabling true roomtemperature superconductivity without rareearth elements or high pressure.This approach not only replicates the V-shaped superconducting gap observed in magicangle graphene but offers a rareearth-free, industrially scalable route to loss-less power grids, magnetic levitation, and quantum technologies.We invite experimental verification using standard copper and accessible THzlaser ultrasound setups. Keywords: Elastic Membrane Cosmology (EMC), Room-Temperature Superconductivity, Copper (Cu), THz Resonance, Hexagonal Lattice, V-shaped Gap, SpatialImpedance, Acoustic Metallurgy