Thermal process simulation of five 1mm-long scan tracks along a 1280-micron by 640-micron by 40-micron mesh of 10-micron voxels set upon an additional substrate block. Scan strategy uses alternating scan direction with each scan track, with tracks spaced 100 microns apart. Uses temperature-dependent material properties of 316L Stainless Steel including conduction, build-surface convection @ 50 W/m^2*K, side-surface convection @ 20 W/m^2*K, fixed-temperature boundary conditions on the bottom surface at 80 degrees celsius, and build-surface radiation with an emissivity of 30%. Evaporation uses a "sticking coefficient" of 1.0 based on work done by Allmen and Blatter 1998 and Bayat et al. VTU time series files are readable by ParaView and PyVista libraries. Nodal thermal results are stored in the "RESULT0" data descriptor.