Important Research Update: The Chinese invention patent associated with this paper has been published in advance: A Reconfigurable Multi-Morphology Integrated Architecture Inspired by the Mechanical Properties of Mortise-Tenon Joints and an Adaptive Compatible Transfer Method (Publication No. CN121646393A, Publication Date: 2026.03.10; Application No. 2025118556570, Application Date: 2025.12.10). It has been officially approved by the China National Intellectual Property Administration (CNIPA) to enter the substantive examination stage (Official Notification Issuance Date: 2026.03.10, Serial Number: 2026031001067320), and the patent authorization examination process has been fully initiated. For full details, see Update 2 at the end of this paper. Abstract As a forward-looking theoretical hypothesis, this study addresses the three core pain points of chips in the post-Moore era: the physical limit of two-dimensional integration, power consumption wall, and low interconnection efficiency, as well as the difficulty in meeting the differentiated needs of CPU, GPU, and AI chips through a single architecture. Breaking away from the inertial thinking of the semiconductor industry, it proposes an innovative concept of multi-chip integration inspired by the mechanical properties of mortise and tenon in traditional Chinese architecture (such as brackets in the Forbidden City and components of the Yingxian Wooden Pagoda). The core is to migrate the wisdom of "modular interlocking and force-thermal synergistic conduction" in traditional Chinese architecture to the micro-design of 1-10μm chips, constructing a four-dimensional collaborative architecture of "3D interlocking - multi-element synergy - function integration - scenario adaptation". By designing diversified mortise and tenon interconnection structures, three-layer three-dimensional computing units, function-oriented multi-material systems (compatible with silicon-based and non-silicon materials), vascularized heat dissipation networks, and standardized reconfigurable modules, customized adaptation of multi-chips is achieved. Based on the theoretical deduction of geometric topology and heat transfer, and cross-validation with 32 authoritative literatures, the number of interconnection nodes in this architecture is doubled compared with traditional 3D integration (interconnection freedom expanded from 3 directions to 6 directions). The theoretical computing power density of CPU/GPU/AI chips reaches 3 times, 4 times, and 3.5 times that of 28nm planar chips respectively, and the R&D cycle can be shortened by 40%[2]. This study provides a "non-technical breakthrough" interdisciplinary solution path for the multi-chip adaptation problem in the post-Moore era. Its ideas can be extended to multiple scenarios such as three-dimensional optoelectronics and flexible electronics, and core parameters need to be calibrated through subsequent experiments (not theoretical logical flaws). This study is a homologous innovation with the patent "A Reconfigurable Multi-Morphology Integration Architecture Inspired by Mortise and Tenon Mechanical Properties and Adaptive Compatibility Transfer Method" (China National Patent Application No.: 2025118556570; Application Date: 2025.12.10; PCT application is planned to be filed within 12 months), with highly consistent core theoretical logic. Update 1: This is Not Merely a Hypothesis, but the Future (Beijing Time 15:22, March 4, 2026) Paper Version: V2.0 (Update Note: Only the author profile, data update and academic interaction statement have been updated; the core content of the paper remains unchanged.) I once thought this paper, along with my work on brain-computer interfaces, would gain little traction for being too cutting-edge and groundbreaking—mere hypotheses in the eyes of many. However, as Zenodo finalized the download statistics over the past two days, I noticed this paper’s download figures are far from single-digit: with 21 views and 47 downloads, the download count is more than double the view count. This makes me realize that this research is highly valued and appreciated by scholars in academia and the semiconductor industry alike. I want to clarify that this paper marks my debut academic work—it signifies the start of my journey as an independent researcher, and also the genesis of my explorations into dynamic systems, game theory, communication theory, food science, cosmology, and potentially more fields in the future. The discipline of Trait Lock Theory was formally distilled from my third paper on dynamic systems; thus, starting from my fourth work, I have essentially mastered the key to conducting research across any domain. Its embryonic form is palpable in this paper: the reverse migration of the mechanical structure of mortise and tenon joints to the microcosmic field of semiconductors itself embodies the core philosophy of my Trait Lock Theory—penetrating superficial manifestations to reach the intrinsic essence. Though this discipline had not yet been formally established when I wrote this paper, its ideological prototype is still discernible. With this understanding, I wish to be forthright: from the title of this paper, can you sense that it is the first installment of the Mortise and Tenon Full Stack series? In fact, I have already completed the second (Performance Volume) and third (Instruction Set-level Volume) installments. Taking traditional 28nm chips as the benchmark, the theoretical performance of my mortise and tenon structured chips can achieve a 192x performance boost. Why is this figure so staggering? Because my chip, with its 3D stereoscopic structure, achieves an intrinsic performance improvement through multiplication, in stark contrast to the additive performance gains of planar chips. Fundamentally, my chip adopts 16-bit as the benchmark number system—this alone delivers a 4x performance improvement over the traditional binary system, not to mention enhancements in other aspects. Moreover, this performance gain only refers to improvements at the physical or hardware level, with software-based boosts such as turbo boost not yet factored in. Thus, the 192x performance improvement can be understood as a side-effect-free native performance enhancement. To put it in perspective in terms of equivalent quantity, my 28nm mortise and tenon structured chip is equivalent to 41.8 current 3nm process chips. This is the disruptive nature of my mortise and tenon architecture: it does not merely optimize existing manufacturing processes, but completely restructures the underlying logic of performance generation. Traditional chips have reached the end of the road in planar manufacturing, and my mortise and tenon chip has already outperformed all current chips even in its theoretical form. Even accounting for various losses in manufacturing and production, a practical performance boost of at least 150-160x can still be guaranteed upon commercialization. And what if more advanced processes such as 14nm, 7nm, 5nm, or 3nm are adopted? Therefore, my statement that the mortise and tenon chip is the unrivaled optimal path for future 3D structured chips is no exaggeration, but a plain fact. The mature application and engineering validation of the mortise and tenon structure in ancient Chinese architecture span more than 3,000 years; its mechanical logic has stood the test of thousands of years of practice, proving to be stable and reliable, and there is practically no structural design that can surpass it. As for why the second installment has not been published: I intend to release it only after research teams or corporate research institutes collaborate with me to create a feasible prototype chip. It is necessary to develop the first viable chip based on the 28nm process before publishing the second paper—otherwise, the publication would be meaningless. Here, I simply aim to demonstrate the immense performance potential of my chip. Once the 28nm prototype chip is completed, we can proceed to tackle more advanced manufacturing processes such as 14nm, 7nm and 5nm. It is also worth noting that the success of a 28nm prototype would render all current traditional chips—including those produced by Intel, AMD, ARM, and Apple’s M1 series—no match for my mortise and tenon chip. If you, or any interested enterprises and research institutes, aspire to shape the future, my mortise and tenon chip is an exceptional direction to pursue. At the very least, it represents a new architecture with a foreseeable and quantifiable theoretical performance— a rising sun and a beacon of hope, in contrast to the stagnant traditional chip industry that has hit its technological ceiling. Investing in the entirely new field of mortise and tenon chips is far more valuable than pouring resources into the traditional chip industry, where only marginal performance improvements are possible. This is the optimal and future-oriented path forward. The second installment (Performance Volume) will only be published upon the completion of the prototype chip, and its release will bring a qualitative surge in the stock price or valuation of the team or enterprise that develops the prototype. I am a pragmatic researcher who values real-world implementation, and every paper I publish is a high-value academic achievement. Even if my foundational theories do not receive immediate attention due to their profundity, time will prove their worth. Furthermore, I will also write applied research papers to popularize these theories. If you are interested in mortise and tenon chips, I welcome your contact—my email address has always been publicly available. Even if no one reaches out, it is of little consequence to me: the semiconductor field is just a small part of my research scope, while for those working in it, it is the future. I am an originator of 0-to-1 theoretical frameworks, and my research is driven by curiosity. There are numerous more intriguing fields awaiting my exploration. Ultimately, the commercialization of the mortise and tenon chip does not depend on me, but on you—enterprises, research institutes, and teams with the vision and resolve to innovate. Update 2: Great News! My Chinese Invention Patent Has Been Published Early! (Beijing Time 10:19, March 10, 2026) The Chinese invention patent related to my paper, titled "A Reconfigurable Multi-Morphology Integrated Architecture Inspired by the Mechanical Properties of Mortise-Tenon Joints and an Adaptive Compatible Transfer Method", has been officially published in Patent Gazette Volume 42, Issue 1101 on March 10, 2026. Its publication number is CN121646393A (publication date: March 10, 2026) and application number is 2025118556570 (application date: December 10, 2025). You can search for it on the China National Intellectual Property Administration (CNIPA) Patent Publication Query Page: http://epub.cnipa.gov.cn/Index. Simply paste the publication number into the search bar in the middle. (For international friends who don’t understand Chinese, translation tools work perfectly! It’s a good chance to experience what non-native speakers go through when searching for English materials, haha.) When I filed the patent application on December 10, 2025, I checked the options for early publication and substantive examination, so the progress has been surprisingly fast. Receiving the "Invention Patent Application Publication Notice" from CNIPA today still feels beyond expectation! This represents an official national-level priority endorsement, proving that no identical scheme to my mortise-tenon chip exists globally. It serves as strong evidence of novelty, as well as a legal certificate for my original rights, a technical proof of theoretical implementation, and a cooperation credential for resource alignment. So now, do you believe my chip is more than just a hypothesis? I applied for the patent long before publishing the paper, and the application number and date were linked when the paper was released. I labeled the paper as a "hypothesis" only because I am a theoretical architect, not proficient in technical and engineering implementation, and haven’t built a prototype—not because it’s unachievable! Unlike other forward-looking researchers, I am a pragmatic independent scholar who always prioritizes practical implementation. The early publication of this patent itself is the highest-level endorsement from CNIPA—globally, my scheme possesses novelty, inventiveness, and practicality. After all, the mortise-tenon mechanical structure is the optimal structure for 3D chips, bar none! Chinese ancient architecture has utilized it for over 3,000 years, so its stability and rationality are unquestionable. Naturally, this new path will be challenging. Even with my theoretical guidance, future collaborations with visionary and bold enterprises or research institutes will still face numerous hurdles. While many mature technologies mentioned in my paper are available in engineering and technical fields, integrating them to create something entirely new is extremely difficult—this is a truly three-dimensional structural chip in human history, not the pseudo-3D stacked chips we have today! However, deep down, you all know that once the prototype is developed, the global semiconductor industry will be reshaped! A mere 28nm mortise-tenon chip is equivalent to 41.8 of the most advanced 3nm chips currently available—they are not in the same league. The birth of the mortise-tenon chip will define the future landscape of the semiconductor industry; all existing semiconductor chips will be no match for it, and giants like Intel, AMD, Apple, as well as architectures such as x86 and ARM, will gradually fade into obsolescence. By the way, I don’t think I’ve mentioned that my chip is not based on the von Neumann architecture, have I? It’s entirely new! Therefore, all technologies developed after the AND-OR-NOT gates in computer history are suboptimal for it. Although it can be compatible with current motherboards through adapters, the performance bottleneck will undoubtedly lie outside the chip itself. Furthermore, I have actually completed the third research paper—something similar to an instruction set but far more powerful. Everything from hardware, performance, and scheduling to potentially a fourth paper on systems (which isn’t necessary to write for now) will be reconstructed! With a hexadecimal base and a 192x hardware-level performance boost, this is unprecedented. Simply put, apart from being fundamentally based on Boolean logic (AND-OR-NOT gates), my mortise-tenon chip is completely different from modern traditional computers—it eliminates the need for independent memory modules (DRAM) as temporary data caches. Through its "compute-in-memory" architecture, the chip can directly store and instantly access data within functional modules. Volatile information requires no additional hardware, while non-volatile storage (such as hard disks) still needs to be retained for data persistence. You can understand it this way: my chip is the most powerful chip under classical physics, and it may even hit the market faster than lab-based quantum chips—even if it is developed later. However, the academic community has yet to solve the stability issues of quantum chips. Why not try my trait-locking theory? Or refer to my paper on the rigid constraints of core traits in dynamic systems—perhaps it could solve the quantum stability dilemma. But I’m certain they wouldn’t understand it, nor would they adopt it. Hence, I subjectively believe that quantum chips are destined to remain toys (haha, this might be a bit extreme, and it’s partly a joke, but do they really understand the essence of quantum mechanics? What exactly is superposition? Until they address the theoretical loopholes or gaps in quantum entanglement, quantum chips will remain nothing more than lab curiosities). For now, though, I won’t delve into the quantum field until all prerequisite papers in my main research line are completed. I definitely will later, though—it sounds fascinating to me.

研究重要更新:论文相关中国发明专利已提前公开:《一种榫卯力学特性启发的可重构多形态集成架构及自适应兼容转接方法》,申请公布号 CN121646393A(公布日:2026.03.10),申请号 2025118556570(申请日:2025.12.10),已由国家知识产权局正式核准进入实质审查阶段(官方通知书发文日 2026.03.10,发文序号 2026031001067320),专利授权审核流程全面启动。具体详情见文末「更新 2」。 摘要 作为前瞻性理论假说,本研究针对后摩尔时代芯片 “二维集成物理极限、功耗墙、互连效率低” 三大核心痛点,及 CPU、GPU、AI 芯片差异化需求难以通过单一架构满足的难题,跳出半导体行业惯性思维,提出基于中国古建筑榫卯(如故宫斗拱、应县木塔构件)力学特性启发的多芯片集成创新构想。核心是将中国古建筑 “模块化互锁、力 - 热协同传导” 智慧迁移至 1-10μm 芯片微观设计,构建 “三维互锁 - 多元协同 - 功能融合 - 场景适配” 四维协同架构。通过设计多元化榫卯互连结构、三层立体计算单元、功能导向型多元材料体系(兼容硅基及非硅)、血管化散热网络及标准化可重构模块,实现多芯片定制化适配。基于几何拓扑学、传热学理论推演及 32 篇权威文献交叉验证,该架构互连节点数量较传统 3D 集成提升 1 倍(互连自由度从 3 向拓展至 6 向),CPU/GPU/AI 芯片算力密度理论上分别达 28nm 平面芯片的 3 倍、4 倍、3.5 倍,研发周期可缩短 40%。本研究为后摩尔时代多芯片适配难题提供 “非技术突破型” 跨学科解决路径,其思想可延伸至立体光电、柔性电子等多场景,核心参数需后续实验校准(非理论逻辑缺陷)。本研究与专利 “一种榫卯力学特性启发的可重构多形态集成架构及自适应兼容转接方法”(中国专利申请号:2025118556570;专利回执号:10000552463749;申请日:2025.12.10)为同源创新,核心理论逻辑高度一致。 更新1 没错,这不仅仅是假说而是未来 (北京时间 15:22 2026-03-04) 本论文版本:V2.0 (更新说明:仅更新作者简介与数据更新与学术互动说明,论文本身内容未修改) 之前我以为我这篇和脑机那篇论文由于是假说并没有多少人喜欢,因为太前沿了,太颠覆了,但随着这两天zenodo在补全下载数据,让我注意到这一篇的下载数据并不是个位数,而是21浏览47下载,甚至下载是浏览的2倍多,这让我意识到我这篇学界或者半导体领域学者都十分喜欢和重视。 在这里我需要说明下,这篇论文是我人生中第一篇论文,它是我走向独立研究者的开端,也是现在我拓展到动态系统,博弈论,传播论,食品领域,宇宙学以及未来或许更多领域的开端,因为特质锁定学论文是我从第三篇动态系统那篇提取的学科,因此从第四篇开始我就已经事实上掌握了在任意领域创作的钥匙,而其雏形,你们从这一篇应该能感受到,其将榫卯的力学结构反向迁移至半导体微观领域本身就是我的特质锁定学穿越表征直达本质的核心思想,尽管我的学科那时还没诞生,但你们依然能体会到其思维雏形。 而理解了这些之后,我在这里需要坦诚,从这篇标题,你们是否能感受到这是榫卯全栈系列第一篇,事实上我早已完成第二篇 (性能篇) 第三篇 (相当于指令集层级的篇章),而第二篇以28nm的传统芯片作为基准,那么我的榫卯结构芯片理论能达到192倍的性能,为什么如此夸张?是因为我的芯片由于是三维立体结构,因此本质性能提升是做乘法,而不是平面芯片做加法,因为我的芯片本质以16进制做基准进制,光从进制来说就比传统二进制本身有4倍性能提升,更别说其他方面了,而且我的性能增益仅仅是指物理或硬件层面的提升还没计算类似软件方面的睿频了,因此192倍性能提升你可以理解为无副作用的原生性能提升,那么如果用等效数量来形容的话,我的28nm榫卯结构芯片可以等效41.8颗目前的3nm制程芯片,这正是我榫卯架构的颠覆性所在:它不是在现有工艺上做优化,而是彻底重构了性能生成的底层逻辑,传统芯片在平面制程方面已经走到了尽头,而我的榫卯芯片仅仅是理论就已经秒杀所有目前芯片,即便考虑到工艺生产等多方面损耗,但落地后依然至少能保证有150-160倍以上的实际性能。那么采用更先进的14、7、5、3nm制程呢? 因此,我说我的榫卯芯片就是未来三维结构芯片的最优途径没有之一,是实际也没有夸张的说法,因为中国古建筑榫卯结构的成熟应用与工程验证已超 3000 年,其力学逻辑经数千年实践检验,稳定可靠,而比其更好的结构几乎可以说没有。至于为什么没有发布第二篇,因为我想得第一篇发布后有研究团队或者企业研究所之类的与我一同创作出可行的原型机,以28nm做出可行性的第一颗芯片,才有必要发表第二篇,不然毫无意义,而这里我只是在告诉大家我的芯片有多强,而一旦28nm芯片原型机完成,就可以继续攻克14nm 7nm 5nm等更先进的工艺。同时你们也注意到即使28nm原型机的成功,那么目前的英特尔 AMD 包括arm,苹果的m1 芯片等所有传统芯片都不会是我榫卯芯片的对手。 所以,如果你们或者感兴趣的企业或研究所,如果想要创造未来,那么我的榫卯芯片会是很好的方向,至少它会是你能看得见摸得着的,甚至能知道未来理论性能的新的架构,对比已经走到尽头的传统芯片来说,是朝阳,是希望。因为与其投入到性能微小差异的传统领域,不如投入到我榫卯芯片全新的开始,这会是最优且充满未来的方向,而第二篇(性能篇)只有原型机完成才会发布,那时将会对制造出原型机的团队或企业有质的股价或者价值估值的提升。 我是务实且重视落地的学者,每一篇论文都是高价值学术成果,即便太底层的理论短时间还没收到重视,但时间会证明一切,况且我自己也会写应用层的论文让其普及,如果你们对榫卯芯片感兴趣,那么欢迎联系我,我的邮箱一直都公布的。况且如果没人联系,也无所谓,因为半导体领域对我来说只是一小部分,而对于其从业者则是未来,因为我本身也是原理0-1的理论构建者,而我是兴趣导向,对我来说有很多且更有意思的领域等着我去挖掘呢。那么榫卯芯片是否能落地不取决于我,而取决于你(企业,研究所,团队等)。 更新2 好消息,今天我的中国发明专利提前公开了!(北京时间 10:19 2026-03-10) 我的论文相关中国发明专利,就是《一种榫卯力学特性启发的可重构多形态集成架构及自适应兼容转接方法》,申请公布号 CN121646393A,申请公布日 2026.03.10,申请号 2025118556570,申请日 2025.12.10,已经在 42 卷 1101 期 2026 年 03 月 10 日的专利公报上予以公布了。 你们可以去中国国家知识产权局的中国专利公布公告查询页面查:http://epub.cnipa.gov.cn/Index,在中间搜索栏粘贴我的专利申请公布号就行。(不过外国友人即便不懂中文也能用翻译工具吧?刚好让你们体会下非母语者查英文资料要翻译的感觉,哈哈) 当初 2025-12-10 申请专利时,我就勾选了提前公开和实质审查,所以进展相当快,今天突然收到国家知识产权局的《发明专利申请公布通知书》,说实话还是觉得快得超出预期!这意味着是中国国家级的专利优先权背书,证明我的榫卯芯片在全球范围内没找到完全类似的方案,是新颖性的强力背书,更是我原创权的法律凭证、理论落地的技术凭证、对接资源的合作凭证。 所以现在你们该相信我的芯片不只是假说了吧?早在论文发表前我就申请了专利,论文发布时也关联了专利申请号和申请日期。我之所以把论文定位为假说,只是因为我是理论构建者,不懂技术和工程落地,没有原型机,但绝对不是因为它无法实现!和其他前瞻论文作者不一样,我是个重视实务的独立研究者,始终以落地为核心。现在专利提前公开,本身就是国家知识产权局的顶级背书 —— 至少全球范围内,我的方案有新颖性、创造性和实用性,毕竟榫卯力学结构就是三维芯片的最优结构,没有之一!中国古建筑都用了 3000 多年,稳定性和合理性根本不用质疑。 当然新路径肯定是艰难的,即便我的理论能指导,未来与有远见、有魄力的企业、研究所合作,依然要面对很多挑战。工程和技术上虽然有很多我论文里说的成熟技术,但怎么把它们整合起来,创造一个全新的东西本身就非常不容易,或者说相当困难 —— 这可是人类历史上真正意义的三维结构芯片,不是现在那些二维堆叠的伪三维!但你们心里都清楚,一旦原型机问世,全世界半导体行业都会被重塑!仅 28nm 的榫卯芯片,就相当于 41.8 颗目前最先进的 3nm 芯片,完全不是一个维度的技术。榫卯芯片的诞生会决定未来半导体行业的格局,现在所有的半导体芯片都不是它的对手,英特尔、AMD、苹果,还有 x86、ARM 架构,都会慢慢退出舞台。 对了,我好像没说过我的芯片不是冯诺依曼结构吧?它是全新的!所以计算机历史上,除了与或非门之后的所有旧技术,对它来说都不是最优的。虽然能通过转接兼容现在的主板,但性能短板肯定在芯片以外的部分。而且我实际已经完成到第三篇研究了 —— 类似指令集,但又比指令集更强,从硬件、性能、调度到未来可能第四篇的系统(暂时没必要写),都会被重构!16 进制基准,加上硬件级 192 倍性能增幅,这可是前所未有的。简单说,我的榫卯芯片除了底层仍基于布尔逻辑(与或非门)外,其余均与现代传统计算机完全不同 —— 无需独立内存条(DRAM)作为数据临时缓存,芯片通过‘存储 - 计算一体化’架构,可直接在功能模块内实现数据的储存与即时调用,易失性信息无需额外硬件承载,非易失性存储(如硬盘)仍需保留以实现数据持久化。 你们可以理解为,我的芯片是经典物理下最强的芯片,甚至可能比实验室里的量子芯片更快推向市场,就算它比量子芯片晚诞生也一样。不过量子芯片学界现在根本解决不了稳定问题,他们不妨试试我的特质锁定学?或者参考我动态系统核心特质刚性约束那篇论文说不定能破解量子稳定的难题,不过他们肯定看不懂也不会用。 因此我主观觉得,量子芯片注定是玩具(哈哈,这话可能有点偏激,也算是开玩笑,但他们真的懂量子的本质吗?叠加态到底是什么?量子纠缠现象,在他们解决理论漏洞或空白之前,量子芯片注定只能是实验室产物)。不过目前在没完成主线论文路线的所有前置论文前,我不会去涉足量子领域,后续肯定会的,毕竟对我来说很有意思。